Overview

What is new in the 2nd Edition

Since the publication of the 1st edition of this book in 1996, CMOS manufacturing technology has continued its breathtaking pace, scaling to ever-smaller dimensions. Minimum feature sizes are now approaching the 100 nm realm. Circuits are becoming more complex challenging the productivity of the designer, while the plunge into the deep-submicron space causes devices to behave differently, and brings to the forefront a number of new issues that impact the reliability, cost, performance, power dissipation, and reliability of the digital IC. The updated text reflects the ongoing (r)evolution in the world of digital integrated circuit design, caused by this move into the deep-submicron realm. This means increased importance of deep-submicron transistor effects, interconnect, signal integrity, high-performance and low-power design, timing, and clock distribution. In contrast to the 1st edition, the text focuses entirely on CMOS ICs.

A full description of the table-of-contents is available in pdf-format.